? semiconductor components industries, llc, 2006 october, 2006 ? rev. 8 1 publication order number: mc74ac10/d mc74ac10, mc74act10 triple 3?input nand gate features ? outputs source/sink 24 ma ? act10 has ttl compatible inputs ? pb ? free packages are available 13 14 12 11 10 9 8 2 1 34567 gnd v cc figure 1. pinout: 14 ? lead packages conductors (top view) maximum ratings rating symbol value unit dc supply voltage (referenced to gnd) v cc ? 0.5 to +7.0 v dc input voltage (referenced to gnd) v in ? 0.5 to v cc +0.5 v dc output voltage (referenced to gnd) v out ? 0.5 to v cc +0.5 v dc input current, per pin i in 20 ma dc output sink/source current, per pin i out 50 ma dc v cc or gnd current per output pin i cc 50 ma storage temperature t stg ? 65 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. tssop ? 14 dt suffix case 948g 1 14 soeiaj ? 14 m suffix case 965 1 14 soic ? 14 d suffix case 751a 1 14 1 14 pdip ? 14 n suffix case 646 http://onsemi.com see detailed ordering and shipping information in the package dimensions sect ion on page 5 of this data sheet. ordering information
mc74ac10, mc74act10 http://onsemi.com 2 recommended operating conditions symbol parameter min typ max unit v cc supply voltage ac 2.0 5.0 6.0 v act 4.5 5.0 5.5 v in , v out dc input voltage, output voltage (ref. to gnd) 0 ? v cc v t r , t f input rise and fall time (note 1) ac devices except schmitt inputs v cc @ 3.0 v ? 150 ? v cc @ 4.5 v ? 40 ? ns/v v cc @ 5.5 v ? 25 ? t r , t f input rise and fall time (note 2) act devices except schmitt inputs v cc @ 4.5 v ? 10 ? ns/v v cc @ 5.5 v ? 8.0 ? t j junction temperature (pdip) ? ? 140 c t a operating ambient temperature range ? 40 25 85 c i oh output current ? high ? ? ? 24 ma i ol output current ? low ? ? 24 ma 1. v in from 30% to 70% v cc ; see individual data sheets for devices that differ from the typical input rise and fall times. 2. v in from 0.8 v to 2.0 v; see individual data sheets for devices that differ from the typical input rise and fall times. dc characteristics symbol parameter v cc (v) 74ac 74ac unit conditions t a = +25 c t a = ? 40 c to +85 c typ guaranteed limits v ih minimum high level input voltage 3.0 1.5 2.1 2.1 v out = 0.1 v 4.5 2.25 3.15 3.15 v or v cc ? 0.1 v 5.5 2.75 3.85 3.85 v il maximum low level input voltage 3.0 1.5 0.9 0.9 v out = 0.1 v 4.5 2.25 1.35 1.35 v or v cc ? 0.1 v 5.5 2.75 1.65 1.65 v oh minimum high level output voltage 3.0 2.99 2.9 2.9 i out = ? 50 a 4.5 4.49 4.4 4.4 v 5.5 5.49 5.4 5.4 v *v in = v il or v ih 3.0 ? 2.56 2.46 ? 12 ma 4.5 ? 3.86 3.76 i oh ? 24 ma 5.5 ? 4.86 4.76 ? 24 ma v ol maximum low level output voltage 3.0 0.002 0.1 0.1 i out = 50 a 4.5 0.001 0.1 0.1 v 5.5 0.001 0.1 0.1 v *v in = v il or v ih 3.0 ? 0.36 0.44 12 ma 4.5 ? 0.36 0.44 i ol 24 ma 5.5 ? 0.36 0.44 24 ma i in maximum input leakage current 5.5 ? 0.1 1.0 a v i = v cc , gnd i old ?minimum dynamic output current 5.5 ? ? 75 ma v old = 1.65 v max i ohd 5.5 ? ? ? 75 ma v ohd = 3.85 v min i cc maximum quiescent supply current 5.5 ? 4.0 40 a v in = v cc or gnd *all outputs loaded; thresholds on input associated with output under test. ?maximum test duration 2.0 ms, one output loaded at a time. note: i in and i cc @ 3.0 v are guaranteed to be less than or equal to the respective limit @ 5.5 v v cc .
mc74ac10, mc74act10 http://onsemi.com 3 ac characteristics (for figures and waveforms ? see section 3 of the on semiconductor fact data book, dl138/d) symbol parameter v cc * (v) 74ac 74ac unit fig. no. t a = +25 c c l = 50 pf t a = ? 40 c to +85 c c l = 50 pf min typ max min max t plh propagation delay 3.3 1.5 6.0 9.5 1.0 10.5 ns 3 ? 5 5.0 1.5 4.5 7.0 1.0 8.0 t phl propagation delay 3.3 1.5 5.5 8.5 1.0 10.0 ns 3 ? 5 5.0 1.5 4.0 6.0 1.0 6.5 *voltage range 3.3 v is 3.3 v 0.3 v. voltage range 5.0 v is 5.0 v 0.5 v. dc characteristics symbol parameter v cc (v) 74act 74act unit conditions t a = +25 c t a = ? 40 c to +85 c typ guaranteed limits v ih minimum high level input voltage 4.5 1.5 2.0 2.0 v v out = 0.1 v 5.5 1.5 2.0 2.0 or v cc ? 0.1 v v il maximum low level input voltage 4.5 1.5 0.8 0.8 v v out = 0.1 v 5.5 1.5 0.8 0.8 or v cc ? 0.1 v v oh minimum high level output voltage 4.5 4.49 4.4 4.4 v i out = ? 50 a 5.5 5.49 5.4 5.4 *v in = v il or v ih 4.5 ? 3.86 3.76 v i oh ? 24 ma 5.5 ? 4.86 4.76 ? 24 ma v ol maximum low level output voltage 4.5 0.001 0.1 0.1 v i out = 50 a 5.5 0.001 0.1 0.1 *v in = v il or v ih 4.5 ? 0.36 0.44 v i ol 24 ma 5.5 ? 0.36 0.44 24 ma i in maximum input leakage current 5.5 ? 0.1 1.0 a v i = v cc , gnd i cct additional max. i cc /input 5.5 0.6 ? 1.5 ma v i = v cc ? 2.1 v i old ?minimum dynamic output current 5.5 ? ? 75 ma v old = 1.65 v max i ohd 5.5 ? ? ? 75 ma v ohd = 3.85 v min i cc maximum quiescent supply current 5.5 ? 4.0 40 a v in = v cc or gnd *all outputs loaded; thresholds on input associated with output under test. ?maximum test duration 2.0 ms, one output loaded at a time.
mc74ac10, mc74act10 http://onsemi.com 4 ac characteristics (for figures and waveforms ? see section 3 of the on semiconductor fact data book, dl138/d) symbol parameter v cc * (v) 74act 74act unit fig. no. t a = +25 c c l = 50 pf t a = ? 40 c to +85 c c l = 50 pf min typ max min max t plh propagation delay 5.0 1.0 ? 9.0 1.0 10.0 ns 3 ? 5 t phl propagation delay 5.0 1.0 ? 9.0 1.0 9.5 ns 3 ? 5 *voltage range 5.0 v is 5.0 v 0.5 v. capacitance symbol parameter value typ unit test conditions c in input capacitance 4.5 pf v cc = 5.0 v c pd power dissipation capacitance 25 pf v cc = 5.0 v
mc74ac10, mc74act10 http://onsemi.com 5 marking diagrams a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g or = pb ? free package pdip ? 14 soic ? 14 tssop ? 14 mc74ac10n awlyywwg mc74act10n awlyywwg soeiaj ? 14 74act10 alywg ac10g awlyww 1 14 ac10g awlyww 1 14 (note: microdot may be in either location) act 10 alyw ordering information device package shipping ? mc74ac10n pdip ? 14 25 units/rail mc74ac10ng pdip ? 14 (pb ? free package) mc74act10n pdip ? 14 mc74act10ng pdip ? 14 (pb ? free package) mc74ac10d soic ? 14 55 units/rail MC74AC10DG soic ? 14 (pb ? free package) mc74ac10dr2 soic ? 14 2500/tape & reel mc74ac10dr2g soic ? 14 (pb ? free package) mc74act10d soic ? 14 55 units/rail mc74act10dr2 soic ? 14 2500/tape & reel mc74act10dr2g soic ? 14 (pb ? free package) mc74act10dtr2 tssop ? 14* mc74act10dtr2g tssop ? 14* mc74ac10m soeiaj ? 14 50 units/rail mc74act10mel soeiaj ? 14 2000/tape & reel mc74act10melg soeiaj ? 14 (pb ? free package) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *this package is inherently pb ? free.
mc74ac10, mc74act10 http://onsemi.com 6 package dimensions pdip ? 14 case 646 ? 06 issue p 17 14 8 b a dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l m ??? 10 ??? 10 n 0.015 0.039 0.38 1.01 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. f hg d k c seating plane n ? t ? 14 pl m 0.13 (0.005) l m j 0.290 0.310 7.37 7.87
mc74ac10, mc74act10 http://onsemi.com 7 package dimensions soic ? 14 case 751a ? 03 issue h notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. ? a ? ? b ? g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t ? t ? f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 7.04 14x 0.58 14x 1.52 1.27 dimensions: millimeters 1 pitch soldering footprint* 7x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74ac10, mc74act10 http://onsemi.com 8 package dimensions tssop ? 14 case 948g ? 01 issue b dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ? w ? . s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ? u ? seating plane 0.10 (0.004) ? t ? ??? ??? ??? section n ? n detail e j j1 k k1 ? w ? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ? v ? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74ac10, mc74act10 http://onsemi.com 9 package dimensions soeiaj ? 14 case 965 ? 01 issue a h e a 1 dim min max min max inches ??? 2.05 ??? 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.004 0.008 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 ??? 1.42 ??? 0.056 a 1 h e q 1 l e 10 0 10 l e q 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). 0.13 (0.005) m 0.10 (0.004) d z e 1 14 8 7 e a b view p c l detail p m a b c d e e 0.50 m z on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mc74ac10/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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